Ansys Lumerical FDTD
Ansys Lumerical FDTD is the gold-standard for modeling nanophotonic devices, processes, and materials. The integrated design environment provides scripting capability, advanced post-processing, and optimization routines. This finely tuned implementation of the FDTD method delivers best-in-class solver performance over a broad spectrum of applications. The integrated design environment provides scripting capability, advanced post-processing and optimization routines, allowing you to focus on your design and leave the rest to us. A range of benefits allow for flexible and customizable models and simulations. Ansys Lumerical FDTD models nanophotonic devices, processes and materials so you can focus on creation. Lumerical FDTD is the gold-standard for modeling nanophotonic devices, processes and materials. This finely tuned implementation of the FDTD method delivers reliable, powerful and scalable solver performance over a broad spectrum of applications.
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Analytic Solver
Analytic Solver Optimization - 100% upward compatible from the Excel Solver - handles every type and size of the conventional optimization problem (without uncertainty). Unlike other optimization software, it algebraically analyzes your model structure and maximally exploits multiple cores in your PC. You can solve nonlinear models 10 times larger, and linear models 40 times larger than the Excel Solver, get solutions much faster – and plug-in Solver Engines to handle up to millions of variables! Analytic Solver Simulation gives you easy-to-use, powerful Monte Carlo simulation and risk analysis, decision trees, and simulation optimization using Frontline’s advanced Evolutionary Solver. With 60 probability distributions plus compound distributions, automatic distribution fitting, rank-order and copula-based correlation, 80 statistics, risk measures and Six Sigma functions, multiple parameterized simulations and more.
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Ansys Icepak
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.
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Solver SDK
Use optimization and simulation models in your desktop, Web or mobile application. Use the same high-level objects (like Problem, Solver, Variable and Function), collections, properties and methods across different programming languages. The same object-oriented API is exposed "over the wire" through Web Services WS-* standards to remote clients in PHP, JavaScript, C# and other languages. Procedural languages can use conventional calls that correspond naturally to the properties and methods of the Object-Oriented API. Linear and quadratic programming, mixed-integer programming, smooth nonlinear optimization, global optimization, and non-smooth evolutionary and tabu search are all included. The world's best optimizers, from Gurobi™, XPRESS™ and MOSEK™ for linear, quadratic and conic models to KNITRO™, SQP and GRG methods for nonlinear models "plug into" Solver SDK. Easily create a sparse DoubleMatrix object with 1 million rows and columns.
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